Reviewer and Organization

IEEE Membership:
1995 – 1997 Student member of the IEEE  Electron Device Society
1997 – 2007 Member of the IEEE  Electron Device Society
2007 – 2013 Senior member of the IEEE  Electron Device Society
2013 – today IEEE Fellow (Class 2013) of the IEEE Electron Device Society

IEEE Electron Device letters (2007 -2013):
Dal Gennaio 2007 a Febbraio 2013 e’ stato Associate Editor per la rivista IEEE Electron Device letters relativamente all’area Compound Semiconductor Devices.

IEEE Transaction on Electron Device (2015 – 2021 ):
Dal Gennaio 2015 Dicembre 2021 è stato Associate Editor per la rivista IEEE Transaction on Electron Device relativamente all’area Compound Semiconductor Devices.

IEEE EDS ADCOM
Dal 2010 al 2016, membro del comitato “Compound Semic. Devices”
Dal 2012 al 2016, membro del comitato “VLSI”

ORGANIZZAZIONE DI CONFERENZE

E’ stato il Technical Program Chairman del “Workshop on Compound Semiconductor Devices and Integrated Circuits, WOCSDICE 2001 – Cagliari, Maggio 27-30, 2001.

E’ stato il General Chairman dell’11th European Heterostructure Technology Workshop HETECH, 2001, Padova, 28-30 Ottobre 2001.

E’ stato il General Chairman del “Workshop on Compound Semiconductor Devices and Integrated Circuits, WOCSDICE  2007- Venezia,  Maggio 19-20, 2007.

E’ stato il General Chairman dell’17th European Heterostructure Technology Workshop HETECH, 2008, Venezia, 2-5 Novembre 2008.

E’ stato Technical Program Chairman di IEW2010, International ESD Workshop 2010,  Evangelische Akademie, Tutzing, Germany, May 10-13, 2010

E’ stato Technical Program Chairman del 21st European Symposium on Reliability of Electron Devices ESREF 2010, Gaeta (Italy), 11th to 15th October 2010.

E’ stato Technical Program Chairman  del 9th Topical Workshop on Heterostructure Microelectronics, TWHM2011, Gifu, Japan, August 28 – 31, 2011

E’ il General Chair  della Conferenza 23rd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 2012, October 1 – 5, 2012 Cagliari, Italy

Sarà il General Chair della conferenza Workshop on Compound Semiconductor Materials and Devices, WOCSEMMAD2013, February, 2013,

E’ stato il General Chair delle conferenze The 44nd Solid-State Device Research Conference ESSDERC’2012 and the 40th Solid-State Circuits Conference ESSCIRC’2012, Venice Lido,  September 22-26, 2014

E’ stato il General Chair della conferenza IEEE International Reliability Physics Symposium (IRPS), 2020. Conferenza tenuta on line 28 April – 30 May 2020, causa COVID19.

 

PARTECIPAZIONE A COMITATI ORGANIZZATORI

Workshop on Compound Semiconductor Devices and Integrated Circuits, WOCSDICE, Dal 2006 ad oggi fa parte dello Steering Committee di WOCSDICE, un workshop a carattere Europeo (ma con partecipanti anche dal Giappone e dagli Stati Uniti)

Heterostructure Technology Workshop (HETECH) – Dal 2000 ad oggi fa parte dello Steering Committee di HETECH, un workshop a carattere Europeo sulle eterostrutture che favorisce la partecipazione agli studenti di Dottorato.

European Solid-State Device Research Conference, ESSDERC conferenza di carattere Europeo per i dispositivi elettronici. Dal 2008 ad oggi fa Parte dello Steering CommitteeNel 2009 è anche Chair del Sottocomitato “Telecomunication & Power Devices “
Nel 2010 è anche Chair del Sottocomitato “Telecomunication & Power Devices “
Nel 2011 è anche Chair del Sottocomitato “Power, High Frequency, and optoelectronics semiconductor devices”
Nel 2012 è anche Chair del Sottocomitato “Power, High Frequency, and optoelectronics semiconductor devices”

PARTECIPAZIONE AI COMITATI DI CONFERENZE DI CARATTERE INTERNAZIONALE

IEEE International Electron Device Meeting (2003-2007 e 2017 – oggi): Ha contribuito diversi anni alla conferenza IEEE International Electron Device Meeting (IEDM) che rappresenta la più prestigiosa conferenza mondiale sui dispositivi elettronici:

  • Membro del comitato “Quantum Electronics and Compound Semic. devices” nel 2003;
  • Chair del Comitato Quantum Power and Compound Semic. devices nel 2004 e nel 2005
  • European Arrangement Chair (nell’ executive committee) nel 2006 e 2007
  • Membro del comitato “Power Devices” nel 2017 e 2018;
  • Chair del Comitato  “Reliability of Systems and Devices” 2019
  • European Arrangement Chair (nell’ executive committee) nel 2020 e 2021
  • Executive committee – Tutorial Chair nel 2022
  • Executive committee – Course Chair nel 2023

 

IEEE International Reliability Physics Symposium (2005 – oggi): Sta contribuendo da diversi anni alla IEEE International Reliability Physics Symposium (IRPS) che rappresenta la conferenza di riferimento mondiale per l’affidabilità dei dispositivi elettronici:

  • Membro del comitato “Wide Bandgap and Compound Semiconductors” nel 2005 e 2006
  • Vice-Chair, del comitato “Wide Bandgap and Compound Semiconductors” nel 2007
  • Chair del comitato “Wide Bandgap and Compound Semiconductors” nel 2008, ‘09 e ‘10
  • Management Committee nel 2010 (Secretary).
  • Management Committee nel 2011 (Tutorial Chair).
  • Management Committee nel 2012 (TPC Vice Chair & Presentation Chair).
  • Management Committee nel 2013 (Workshop Chair).
  • Management Committee nel 2014 (Arrangment Chair).
  • Management Committee nel 2015 (Financial Chair).
  • Management Committee nel 2016 (Registration Chair).
  • Management Committee nel 2017 (Publicity & Publication Chair)
  • Management Committee nel 2018 (TPC Chair)
  • Management Committee nel 2019 (Vice Gen.Chair)
  • Management Committee nel 2020 (General Chair)
  • Board of Directors Chair nel 2021
  • Chair Emeritous 2022

Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD: Fa parte del Technical Program Committee dell’ EOS/ESD Symposium che rappresenta la conferenza di riferimento mondiale per le problematiche di scariche elettrostatiche nei dispositivi elettronici.
E’ Membro del Sub-Committee “On Chip Physics: Modeling, Simulations and other reliability issues” nel 2006
E’ Membro del Sub-Committee “On-Chip ESD Protection: Bipolar, Smart-Power, High Voltage, RF” nel 2008.
E’ Membro del Sub-Committee “On chip physics, numerical simulation, modeling and reliability issues” nel 2009

International Conference on Solid State Devices and Materials (SSDM 2008), è la conferenza asiatica di maggior rilievo sui dispositivi elettronici.
2008 nel sottocomitato “Compound Semiconductor Circuits, Electron Devices and Device Physics”
2009 nel sottocomitato “Compound Semiconductor Circuits, Electron Devices and Device Physics”
2010 nel sottocomitato “Compound Semiconductor Electron Devices and Related Technologies”
2011 nel sottocomitato “Compound Semiconductor Electron Devices and Related Technologies”
2012 nel sottocomitato “Compound Semiconductor Electron Devices and Related Technologies”

International Electrostatic Discharge Workshop (IEW): IEW, che e’ nato per creare un ponte di collegamento tra le attività ESD negli Stati Uniti e in Europa.
Nel 2008 Fa parte del Management Committee e del Technical Program Committee
Nel 2010 è Chair del Technical Program Committee

European Symposium Reliability on Electron Devices, Failure Physics and Analysis (ESREF) Ha contribuito per diversi anni alla conferenza ESREF che rappresenta la conferenza di riferimento Europeo per l’affidabilità dei dispositivi elettronici:
Chair del comitato Electrostatic Discharge (ESD) nel 2002
Membro del comitato “Failure Mechanisms in New Materials and Transistors” nel 2006
Chair del comitato “Failure mechanisms in microwave, high band gap and photonic devices” nel 2007
Chair del comitato “Photonics, Compound Semic. and Nanomaterials reliability” nel 2008
Chair del comitato “Failure mechanisms in microwave, high band gap and photonic devices” nel 2009
Technical Program Chair nel 2010
Chair del comitato “Failure mechanisms in microwave, high band gap and photonic devices” nel 2011
General Chair nel 2012

European Microwave Week (EuMW) – The European Microwave Integrated Circuits Conference (EUMIC); E’ stato nel panel dei revisori per la Conferenza EuMIC (nella EuMW) negli anni 2005 e 2006.

International Symposium on Compound Semiconductors – ISCS
2011: Fa parte del TPC nel sottocomitato: “F. High Frequency and High Power Electronics”
2012: Fa parte del TPC nel sottocomitato: “F. High Frequency and High Power Electronics”

3rd EOS/ESD/EMI WORKSHOP: “Immunity of electronic applications to electrical (EOS/ESD) and electromagnetic (EMI) stresses: From system level to chip level”, E’ stato nel Technical Programme Committee del 3rd EOS/ESD/EMI WORKSHOP che si e’ tenuto a Tolosa il 18 e 19 Maggio, 2006.

ATTIVITA’ di REVISIONE:

Nel 2008 ha fatto parte della panel dei valutatori del “Wittgenstein Award”, della FWF – Fonds zur Förderung der wissenschaftlichen Forschung – The Austrian Science Fund.

Revisore di progetti di ricerca dell’Istituto per la promozione della ricerca industriale scientifica e tecnologica Belga (Flander Institute for the promotion of Scientific and Technological Research in Industry IWT).

Revisore di progetti di ricerca della Scientific Science Foundation dell’Irlanda nell’anno 2007/2008/2009 (equivalente ai progetti PRIN in Italia).

Revisore di progetti Nazionali Francesi “Agence Nationale de la Recherche (ANR) ” Francia, dal 2008.

ATTIVITA’ di REVISIONE di RIVISTE INTERNAZIONALI:

E’ revisore delle seguenti riviste a carattere internazionale:
IEEE Trans. on Electron Devices,
IEEE Electron Device Letters,
IEEE Trans. on Device and Materials Reliability,
IEE Electronics Letters,
Semic. Science and Technology,
Solid State Electronics,
Microelectronics Reliability,
Applied Physics Letters,
Journal of Applied Physics

 


IEEE Membership:
1995 – 1997 Student member of the IEEE  Electron Device Society
1997 – 2007 Member of the IEEE  Electron Device Society
2007 – 2013 Senior member of the IEEE  Electron Device Society
2013 – today IEEE Fellow (Class 2013) of the IEEE Electron Device Society

IEEE Electron Device letters (2007 -2013):
From January 2007 to February 2013 ha was Associate Editor for the IEEE Electron Device letters –  Compound Semiconductor Devices.

IEEE Transaction on Electron Device (2015 – 2021 ):
From January 2015 to December 2021 he was Associate Editor for the IEEE Transaction on Electron Device – Compound Semiconductor Devices.

IEEE EDS ADCOM
from 2010 to 2016, member of the committee “Compound Semic. Devices”
from 2012 to 2016, member of the committee “VLSI”

 

IEEE EDL EDITOR (2007 – today): Since January 2007 he has been Associate Editor for the IEEE Electron Device Letters in the “Compound Semiconductor Devices” area.

IEEE Membership:  IEEE Fellow Class 2013.

CONFERENCES ORGANIZATION

  • He was the Technical Program Chair of the “Workshop on Compound Semiconductor Devices and Integrated Circuits, WOCSDICE 2001 – Cagliari – Italy, May 27-30, 2001.
  • He was the General Chairman of the 11thEuropean Heterostructure Technology Workshop HETECH, 2001, Padova – Italy, 28-30 October 2001.
  • He was the General Chairman of the “Workshop on Compound Semiconductor Devices and Integrated Circuits, WOCSDICE  2007- Venezia – Italy,  May 19-20, 2007.
  • He was  the General Chairman of the 17th European Heterostructure Technology Workshop HETECH, 2008, Venezia – Italy, 2-5 November 2008.
  • He was the Technical Program Chair of the  21st European Symposium on Reliability of Electron Devices ESREF 2010, Gaeta (Italy), 11th to 15th October 2010,
  • He was the Technical Program Chair of the  9th Topical Workshop on Heterostructure Microelectronics, TWHM2011, Gifu, Japan, August 28 – 31, 2011
  • He is the General Chairman of the 23rd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 2012, October 1 – 5, 2012 Cagliari, Italy;
  • He will be the General Chairman of the Workshop on Compound Semiconductor Materials and Devices, WOCSEMMAD2013, February, 2013
  • He has been the General Chairman of the 44nd Solid-State Device Research Conference ESSDERC’2012 and the 40th Solid-State Circuits Conference ESSCIRC’2012, Venice Lido,  September 22-26, 2014
  • He has been the General Chairman of the IEEE International Reliability Physics Symposium (IRPS), 2020, on-line event due to COVID19, 28 April – 30 May 2020.

PARTICIPATION TO CONFERENCE ORGANIZATION:

IEEE International Electron Device Meeting, IEDM (2003-2007 and 2017 – today)

  • Member of the committee “Quantum Electronics and Compound Semic. devices” in 2003;
  • Chair of the committee “Quantum Power and Compound Semic. Device” in 2004 and 2005
  • Join the “Executive Committee” as European Arrangement Chair in 2006 and 2007
  • Member of the committee “Power devices” in 2017-2018;
  • Chair of the committee “Reliability of Systems and Devices” in 2019
  • Join the “Executive Committee” as European Arrangement Chair in 2020 and 2021
  • Executive Committee”Tutorial Chair in 2022
  • Executive Committee”Course Chair in 2023

IEEE International Reliability Physics Symposium, IRPS (2005 – today)

  • Member of the committee “Wide Bandgap and Compound Semiconductors” in 2005 and 2006
  • Vice-Chair, of the committee “Wide Bandgap and Compound Semiconductors” in 2007
  • Chair of the committee “Wide Bandgap and Compound Semiconductors” in 2008, 2009 and 2010
  •  Management Committee nel 2010 (Secretary).
  • Management Committee nel 2011 (Tutorial Chair).
  • Management Committee nel 2012 (TPC Vice Chair & Presentation Chair).
  • Management Committee nel 2013 (Workshop Chair).
  • Management Committee nel 2014 (Arrangment Chair).
  • Management Committee nel 2015 (Financial Chair).
  • Management Committee nel 2016 (Registration Chair).
  • Management Committee nel 2017 (Publicity & Publication Chair)
  • Management Committee nel 2018 (TPC Chair)
  • Management Committee nel 2019 (Vice Gen.Chair)
  • Management Committee nel 2020 (General Chair)
  • Board of Directors Chair nel 2021
  • Chair Emeritous 2022

Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD (2006 – today)

  • Member of the committee “On Chip Physics: Modeling, Simulations, Reliability” in 2006
  • Member of the committee “On-Chip ESD Protection: BJT, Smart-Power, HV, RF” in 2008.

International Electrostatic Discharge Workshop (IEW)

  • Member of the Management Committee and of the Technical Program Committee in 2008.

International Conference on Solid State Devices and Materials (SSDM 2008)

  • Member of the committee “Compound Semic. Circuits, Electron Devices Physics” in 2008

EUROPEAN CONFERENCES AND WORKSHOPS:

European Symposium Reliability on Electron Devices, Failure Physics and Analysis (ESREF)

  • Chair of the committee Electrostatic Discharge (ESD) in 2002
  • Member of the committee “Failure Mechanisms in New Materials and Transistors” in 2006
  • Chair of the committee “Failure Mech. in Microwave, High Bandgap and Photonic Dev.” in 2007
  • Chair of the committee “Photonics, Compound semic. and Nanomaterials reliability” in 2008

European Solid-State Device Research Conference, ESSDERC Member of the Steering Committee in 2008

The European Microwave Integrated Circuits Conference (EUMIC) within the EuMW. He was in the panel of reviewers for the conference EuMIC in 2005 and 2006.

Workshop on Compound Semiconductor Devices and Integrated Circuits, WOCSDICE He has been member of the Steering Committee since 2006

Heterostructure Technology Workshop (HETECH) He has been member of the Steering Committee since 2000

REVIEWER OF SEVERAL INTERNATIONAL JOURNALS::

IEEE Trans. on Electron Devices, IEEE Electron Device Letters, IEEE Trans. on Device and Materials Reliability, IEE Electronics Letters, Semic. Science and Technology, Solid State Electronics, Microelectronics Reliability, Applied Physics Letters, Journal of Applied Physics.

  • He is a reviewer of research projects for the Belgium Institute for the scientific and technology research promotion (IWT)
  • He is a reviewer of research projects of the “Scientific Science Foundation” – Ireland 2007/08.

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